蘇打掩模版（Soda Mask）使用蘇打玻璃作為基板材料，蘇打玻璃熱膨脹率相對(duì)高于石英玻璃，平整度和耐磨性相對(duì)弱于石英玻璃，成本相對(duì)較低，通常應(yīng)用于中低精度掩模版。蘇打掩模版主要在精度要求較低的領(lǐng)域中使用，包括中低端半導(dǎo)體制造、半導(dǎo)體封裝、光學(xué)器件、中低端顯示面板、觸控屏和電路板制造等領(lǐng)域。
| ITEM | Rank | S | Y | A | B | C | D | E | F | G | H | I |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Design Rule | (μm) | ＞5 | 2-5 | 1-2 | 1 | 0.8 | 0.5 | 0.35 | 0.25 | 0.18 | 0.15 | 0.13 |
| CD Tolerance | (±μm) | ±0.5 | ±0.3 | ±0.2 | ±0.15 | ±0.1 | ±0.075 | ±0.05 | ±0.04 | ±0.03 | ±0.025 | ±0.02 |
| CD Range | (μm) | ≤0.5 | ≤0.3 | ≤0.2 | ≤0.15 | ≤0.1 | ≤0.07 | ≤0.05 | ≤0.04 | ≤0.035 | ≤0.03 | ≤0.025 |
| CD mean to target | (μm) | ±0.5 | ±0.3 | ±0.2 | ±0.15 | ±0.1 | ±0.07 | ±0.04 | ±0.03 | ≤0.03 | ±0.02 | ±0.02 |
| Registration & Overlay | Based on the 1st layer(μm) | ±0.5 | ±0.3 | ±0.2 | ±0.15 | ±0.12 | ±0.10 | ±0.07 | ±0.05 | ≤0.04 | ±0.03 | ±0.02 |
| Defect | Defect size(μm) | ＜4 | ＜2 | ＜1.0 | ＜1.0 | ＜0.75 | ＜0.5 | ＜0.4 | ＜0.3 | ＜0.3 | ＜0.25 | ＜0.20 |
